1. ION BEAM COATER
A unique ion beam based sputter coating system producing continuous, ultra-thin, amorphous coatings free of thermal artifacts making them ideal for FESEM and TEM applications. This is an important advantage over traditional coating techniques such as thermal evaporation, magnetron or RF sputtering that produces coarse deposition structures.
2. PECS SYSTEM – Precision Etching Coating System for SEM, TEM and LM
The ideal instrument for any application requiring sample etching and/or high-resolution sputter coating. The PECS™ is a unique ion beam based etching and sputter coating system producing exceptionally large, clean, viewable areas of specimens for Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM) and Light Microscope (LM) applications. The unique design features incorporated into the PECS™ make it very versatile.
3. CRYO TRANSFER UNIT
Cryo-SEM allows imaging and analysis of biological and other hydrated specimens. Liquids, suspensions, emulsions, polymers and other beam- or vacuum-sensitive specimens may also be easily prepared and examined.
4. CATHODELUMINESENCE DETECTOR (CL)
MonoCL4 is the next generation in the world-leading family of cathodoluminescence (CL) systems from Gatan. It is available in 4 configurations to suit the widest range of applications and requirements: MonoCL4, MonoCL4 Swift, MonoCL4 Plus and MonoCL4 Elite.
5. VACUUM TRANSFER UNIT
Vacuum Transfer Holder permits the transfer of a specimen into the TEM under vacuum or controlled atmosphere.
6. DIRECT DETECTION CAMERA
K2™ is the direct detection camera that counts! With full-frame (4k x 4k pixels) read-out at 400 frames per second, K2 architecture has been designed from the start to be optimized for both single particle structural biology and cryo-tomography, as well as high-speed dynamic and in-situ EM. The uniquely back-thinned sensor is the most radiation-hardened sensor available today, with a lifetime greater than 5 billion electrons per pixel.
7. ULTRSCAN CAMERA
The UltraScan™ was the first digital camera to replace film as a recording medium in the TEM. The critical component of the UltraScan camera family is the High-Contrast Resolution (HCR™) optical stack technology, combining an innovative high resolution scintillator and unique fiber optic technology. Together with state-of-the-art CCD electronics and high-speed, multi-port readout, the UltraScan family sets the reference standard for TEM imaging systems.
8. ULTRASONIC CUTTER
The new Ultrasonic Cutter with variable tuning outperforms the older Model 601 delivering improved power, performance and versatility. Expand your ability to cut brittle materials beyond the 3mm TEM disc. Our wide variety of cutting tools ranging from <1mm to 10mm enables you to accurately cut holes or unique shapes.
9. DISC GRINDER
Pre-thins and polishes samples to reduce ion milling times and improve quality. The 623 produces parallel sided samples quickly and easily and the larger micrometer dial displays the thickness in microns (µm).The ultra-fine thread and pre-loading of the drive screw result in excellent and dependable control of the final specimen thickness within 5µm accuracy.
10. DIMPLE GRINDER
Rapid material removal with minimal damage. Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning.Dimple grinding offers a means of producing quality TEM specimens having a large central area only a few microns thick surrounded by a robust outer rim. This eliminates special handling techniques for fragile specimens.
11. DISC PUNCH
The 659 is the preferred method for cutting TEM discs from metals, alloys and all ductile materials. Design of the cutting piston avoids compression of the sample preventing plastic distortion of the disc during the punching process, particularly in the central region of the specimen.
12. ION POLISHING UNIT
13. ELECTRON ENERGY LOSS SPECTROMETER(EELS)
14. SPECIMEN HOLDERS
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